WaveEtch

client: Matech

The Matech WaveEtch 112 is a desktop version of advanced wet processing semiconductor wafer system. The technology achieves extremely uniform wafer and film wet chemical etching and thinning, resulting in surface flatness to within 3 microns on thinned 150mm wafers. Wafer thinning is critical to back side CCDs, smart cards, high-frequency circuits, and other types of high-performance devices in the semiconductor and telecommunication industries. The device features an integrated wafer loading/wafer rinsing/wafer drying mechanism and a precision 3 D.O.F. robot arm.